Overview
Submicron die bonders for photonics packaging, assembly, and die attach. Bonding of laser bars and diodes, VCSELs, silicon photonics, sensors, flip chip, LEDs, transceivers, and lidar devices. Systems provide high-process flexibility in one platform; manual, motorized, and automated models for a variety of bonding applications.
Products & capabilities
- Production Bonders
- R&D Bonders
- Rework Equipment
- Service & Support
- Bonding Technologies
- Quantum Technologies
- Defense & Security
- Aerospace & Avionics
Services
- Submit a request
- Service & repairs
- Process & application service
- Maintenance
- System upgrade / update
- Tool support
- Installation & relocation service
- Maintenance & adjustment resources
- Remote Support
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