Photonic Packaging & Assembly

ASMPT

A leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics.

Canadian Photonics Fabrication Centre (CPFC)

The Government of Canada website is a single point of access to all programs, services, departments, ministries and organizations of the Government of Canada.

Cutting Edge Optronics

Northrop Grumman solves the toughest problems in space, aeronautics, defense and cyberspace to meet the ever evolving needs of our customers worldwide. Our 95,000 employees define possible every day using science, technology and engineering to create and deliver advanced systems, products and services.

FINETECH

Submicron die bonders for photonics packaging, assembly, and die attach. Bonding of laser bars and diodes, VCSELs, silicon photonics, sensors, flip chip, LEDs, transceivers, and lidar devices. Systems provide high-process flexibility in one platform; manual, motorized, and automated models for a variety of bonding applications.

Opto System Co. Ltd.

Since establishment in 1980, Opto System has been developing and manufacturing the inspection and manufacturing machines used for production and development of optical semi-conductor related products. To reflect our business contents, we named our company Opto System Co., Ltd.Even in the peak of the bubble period of Japan, we simply concentrated on manufacturing and development, which led us to th

Yield Engineering Systems (YES)

Our patented technologies significantly enhance the speed, reliability, and cost-effectiveness of process engineering equipment and lab-to-fab solutions. Learn more.

Kyocera International Inc.

Kyocera Corporation, the headquarters and parent company of the global Kyocera group, was founded in 1959 in Kyoto, Japan as a start-up venture by Dr. Kazuo Inamori and seven colleagues. Kyocera's founders shared a vision of creating a company dedicated to the successful manufacture and sale of innovative, high-quality products based on advanced materials and components. Over the past six decades,

EV Group (EVG)

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection s

SUSS MicroTec Inc.

SUSS is a leading provider of precision-engineered systems and process solutions for microstructuring in the semiconductor industry.

CMC Electronics Inc., Displays and Sensors

CMC specializes in high-reliability, customized solutions, offering design, development, manufacturing, testing, and failure analysis of complex microcircuits, including optoelectronic hybrids and next-level assemblies for the most demanding applications. Our CMC parts offer high sensitivity, high reliability and high resolution performance.

indie Semiconductor

indie is an automotive innovator, developing advanced technologies and solutions to deliver best-in-class automated driver and safety systems and in-cabin experiences—enabling the pursuit of the uncrashable vehicle.

ALTER TECHNOLOGY UK

Our capabilities include electronic design, engineering, assembly, procurement, testing, and long-term conservation of wafers and dies.

Avo Photonics Inc.

State-of-the-art photonics design, development, and manufacturing based in Horsham, PA.

ficonTEC

ficonTEC Home. Manufacturer of automated micro-assembly and testing solutions for the photonics industry. From Lab to Fab.

ficonTEC Inc.

ficonTEC Home. Manufacturer of automated micro-assembly and testing solutions for the photonics industry. From Lab to Fab.

FINETECH GmbH & Co. KG

Your Innovation.Build to Scale. Driven by precision, powered by experience — we deliver die bonding and SMD rework solutions that grow with your needs, from first prototype to automated high-volume production. Find your perfect solution Scalable Solutions for Precision Die Bonding customers trust our expertise 0 + years shaping the semiconductor industry 0 countries served […]

Egide SA

Created in 1986, EGIDE designs, manufactures and sells hermetic packages for the protection and interconnection of a variety of electronic or photonic chips. These packages aim at ensuring the invulnerability of integrated electronic systems or sophisticated chips, which are therefore fragile and sensitive to thermal, atmospheric or magnetic conditions. Egide is a group with an international dimen

SST International

Leading automated component packaging systems and premier contract assembly solutions; high-accuracy wire bond and die attach systems.

ASMPT AMICRA

ASMPT AMICRA GmbH is a worldwide leading supplier of ultra high precision Die Attach Equipment specializing in submicron placement accuracy (±0.2µm@3s). Our equipment offering supports:

PHIX Photonics Assembly

PHIX supplies the photonics industry with design, assembly and packaging services for Photonic Integrated Circuits (PICs).

Lightelligence

Lightelligence is a world-leading provider of optoelectronic hybrid computing power. We uphold the values of openness and inclusiveness, innovate boldly and act pragmatically, committed to the development of photonic technology and related commercial applications, helping to achieve an exponential increase in computing power in the era of artificial intelligence

3D Glass Solutions Inc.

3DGS manufactures glass substrates for advanced packaging to solve the thermal, electrical, and dimensional challenges of next-generation RF, HPC, and photonic systems.

SET Corp. SA

Since 1975, SET has offered flexible Flip-Chip Bonders that can align and bond components with submicron post-bond accuracy.

Remtec Inc.

Remtec is a U.S.-based leader in advanced ceramic circuits and substrates for challenging, complex, hand igh-power electronics applications.

AIXEMTEC GmbH

AIXEMTEC is your one-stop supplier for photonics assembly and test automation machines and related services.

LEW Techniques Ltd.

Since 1966, LEW Techniques has been at the forefront of the micro-electronics industry. From our early days manufacturing microwave diode packaging and supporting the world’s first commercial long-distance optical fibre landline and early submarine cables, we have a proven history of technical excellence.

nanosystec GmbH

Nanosystec is the strong partner for numerous technology and industrial companies worldwide. Our customers include manufacturers for space technology, data transmission as well as automotive and metrology. With more than 20 years of expertise in demanding high-precision production technology, nanosystec provides a unique technology advantage for your project.

nanosystec Inc.

Nanosystec is the strong partner for numerous technology and industrial companies worldwide. Our customers include manufacturers for space technology, data transmission as well as automotive and metrology. With more than 20 years of expertise in demanding high-precision production technology, nanosystec provides a unique technology advantage for your project.

Perspectiva Solutions

The highest quality contract manufacturing of electronic and photonic devices and assembly of cable harnesses

Suzhou Everbright Photonics Co. Ltd.

We are mainly dedicated to the R&D, production and sales of high power diode laser chips, high efficiency diode VCSEL chips, high speed optical communication diode laser chips and devices and systems.The company's high-brightness single-tube chip and fiber-coupled output module, high-power bar and stacked array products have repeatedly broken through in terms of power, brightness, photoel

Tresky Corp.

Tresky's DIE bonders for research and development as well as series production stand for the best bonding results. Made in Germany