Photonics Map

Tresky Corp.

DIE Bonder for R&D and Production

Photonic Packaging & AssemblyMorganville, NJ, United States· 6 staff
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Overview

Tresky's DIE bonders for research and development as well as series production stand for the best bonding results. Made in Germany

Products & capabilities

  • Epoxy / Adhesive Bonder
  • UV Bonder
  • Ultrasonic Bonder
  • Thermocompression Bonder
  • Sinter Bonder
  • Flip Chip Bonder
  • Eutectic Bonder
  • 3D Bonder

Applications & markets

SemiconductorElectronics ManufacturingMedicalAutomotiveAviation and AerospaceTelecommunicationsOptoelectronicsSensorsPlatforms

Services

  • +49 (0) 3302 86692-30
  • +49 (0) 172 847 0249
  • Prototyping & Small Series Production
  • DIE Sorting
  • Process Development

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