3D Glass Solutions Inc.
Advanced Glass Substrates for Semiconductor Packaging - 3DGS
Overview
3DGS manufactures glass substrates for advanced packaging to solve the thermal, electrical, and dimensional challenges of next-generation RF, HPC, and photonic systems.
Products & capabilities
- Integrated Passive Devices (IPD)
- Custom Fabrication
- RF Substrates
- Digital Substrates
- Glass Substrate Stacking (3DHI)
Applications & markets
Services
- Wafer Processing
- Panel Processing
- Engineering Services
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